2017 Semicon Europa Exhibition, Messe Munchen, Munich, DE

This exhibition is being held November 14 - 17, 2017 and we invite you to visit us on Booth B1 – 161. We have again seized this opportunity to demonstrate how we have designed and machined some of the world’s largest components for the Semiconductor industry. This included our unique designs for improving ‘hand dipped’ processing on 450mm Low Profile Wafer Carriers.

For more information and venue details visit: www.semiconeuropa.org

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